Radiation Effects Test Chip Guidelines

Abstract

Test chips and special test structures are assuming a role of ever increasing importance in the development of radiation-hardened microcircuits. The reason for this expanding role lies in the expense and complexity of VHSIC (very high speed integrated circuits) and VLSIC (very large scale integrated circuits) class microcircuits. Special devices are required to (1) investigate failure mechanisms, (2) evaluate process hardness, (3) develop design rules, and (4) provide for hardness assurance monitoring. The purpose of this document is to provide information on a variety of devices which have been found useful in developing radiation-hardened microcircuits for metal oxide semiconductor (epi/bulk, SOS, and SOI) and bipolar technologies.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1991
Accession Number
ADA243813

Entities

People

  • David R. Alexander

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Bipolar Junction Transistors
  • Electronics Industry
  • Electronics Laboratories
  • Failure Mode And Effect Analysis
  • Integrated Circuits
  • Layers
  • Metal Oxide Semiconductors
  • Metal-Semiconductor Junctions
  • Oxides
  • Power Electronics
  • Radiation Effects
  • Schottky Diodes
  • Semiconductor Devices
  • Semiconductors
  • Solid State Electronics
  • Trenches
  • Zener Diodes

Readers

  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics