Fabrication Techniques and Technologies for Missile Seeker Microelectronic Components (Focusing on Multi-Chip Module Substrate Reliability)
Abstract
This report reviews recent multi-chip module (MCM) manufacturing technology developments. MCMs represent an emerging technology which will provide the Army with high-speed processors for missile seekers in a more compact form than offered by previous generations of electronic packaging. Both ceramic (MCM-C) and deposited dielectric (MCM-D) forms are covered, including those incorporating polyimide and new polymer films. Includes literature review of recent manufacturing processes, necessary generic equipment under development and in current practice. Promising developments include low-temperature cofired ceramics, polymer dielectrics with low water absorptivity, new photo-definable polymers, new adhesion promoters, gold thin-film metallization methods, laser ablation of vias, and controlled polymer precursors extrusion. Reliability issues are emphasized in the review, particularly in respect of the severe environmental conditions experienced by missiles, and a detailed review of mechanisms of degradation is included. Recommendations are made on the need for micromechanical and electrical property measurements of candidate MCM materials.
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 1992
- Accession Number
- ADA262809
Entities
People
- B. R. Livesay
- J. B. Schodorf
- L. J. Turbini
- R. A. Bohlander
Organizations
- Georgia Tech Research Corporation