Boiling Heat-Transfer Processes and Their Application in the Cooling of High Heat Flux Devices
Abstract
Water cooling is used extensively at AEDC to prevent the failure of high-enthalpy arc heater components at elevated heat loads where cooling by radiation, conduction, and natural convection from air circulation are ineffective. Other cooling techniques such as the use of liquid metals, transpiration, or film cooling pose their own disadvantages or limitations and are certainly possibilities for providing cooling at much more severe heating conditions where water cooling alone may be inadequate. The current interest is in exploiting backside water cooling to the limit of its capability, especially for arc heater nozzles. Such an application requires an understanding of the parameters that affect the cooling processes and the determination of the limiting point where the surface fails due to inadequate cooling. This report reviews the different processes encountered in backside water cooling and identifies those processes that are desirable for effective cooling of high- enthalpy facility components; identifies those parameters which affect the cooling processes of interest and the trend of cooling performance when the parameters are individually varied; and presents a summary of applicable theoretical, analytical, and experimental work in surface cooling performed in the past 50 years. Boiling heat transfer, High enthalpy, Burnout correlations, Flow boiling, High heat flux, Subcooled boiling, Critical heat flux, Forced convection, Arc heater, Nucleate boiling, Water cooling, Boiling.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 01, 1993
- Accession Number
- ADA266086
Entities
People
- G. R. Beitel
Organizations
- Arnold Engineering Development Complex