Transport Phenomena Studies, VIA Computational Simulation, in Structural Materials Processing.

Abstract

The objective of the present STTR project is to develop computational tools necessary to simulate processing of structural materials. Processes considered are chemical vapor deposition (CVD) and chemical vapor infiltration In the Phase I work discussed in this report, an existing SRA computational fluid dynamics code has been adapted to apply to CVD modeling. Multicomponent diffusion, thermal diffusion, homogeneous and surface reactions and conjugate heat transfer have been included. A model for infiltration of porous preforms has been developed for CVI. The models and code were used to study CVD of silicon carbide, CVD of boron on tungsten wire, and CVI of SiC-SiC preforms. The models were first validate for silicon deposition. In all cases, it was demonstrated that numerical simulation can serve as a design tool by enabling cost-effective parametric study to understand mechanisms and allow optimization. (MM)

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Document Details

Document Type
Technical Report
Publication Date
Jun 07, 1995
Accession Number
ADA297856

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Boundary Layer
  • Chemical Reactions
  • Chemical Vapor Deposition
  • Chemistry
  • Computational Fluid Dynamics
  • Computational Science
  • Differential Equations
  • Energy Transfer
  • Fluid Dynamics
  • Fluid Flow
  • Heat Transfer
  • Materials
  • Materials Processing
  • Modulus Of Elasticity
  • Silicon Carbide
  • Surface Reactions
  • Three Dimensional

Readers

  • Computational Modeling and Simulation
  • Reinforced Composite Materials
  • Thin Film Deposition Science.