Proceedings of the International Electronic Circuit Packaging Symposium (4th) on Advances in Electronic Circuit Packaging Held in Boulder, Colorado on 14-16 August 1963. Volume 4,

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1963
Accession Number
ADA302391

Entities

People

  • Michael A. Marrese

Organizations

  • University of Colorado Boulder

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies
  • Space

DTIC Thesaurus Topics

  • Chemistry
  • Dielectrics
  • Electromagnetic Shielding
  • Electronic Components
  • Electronics Industry
  • Logic Gates
  • Material Degradation Processes
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Measurement
  • Sheet Metal
  • Test And Evaluation
  • Thermal Conductivity
  • Three Dimensional

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems