Develop, Demonstrate, and Verify Large Area Composite Structural Bonding With Polyimide Adhesives.
Abstract
This program was conducted to develop and demonstrate processes for large area structural bonding with polyimide adhesives. The program consisted of two parts: Process Development for PI resin systems and fabrication of Demonstration components. Process development included establishing quality assurance of the basic PI adhesives, non-destructive inspection of fabricated components, developing processes for specific structural forms and qualification of processes through mechanical testing. In the second part of the program, demonstration components were fabricated using the processes developed in part one. The demonstration components consisted of adhesively bonded honeycomb sandwich cover panels, ribs, and leading edge covers of Celion graphite/LARC-160 polyimide laminates, and a Technology Demonstration Segment (TDS) representative of the Space Shuttle aft body flap. jg p160
Document Details
- Document Type
- Technical Report
- Publication Date
- May 01, 1982
- Accession Number
- ADA302691
Entities
People
- Arnold A. Stenersen
- Bashir D. Bhombal
- Donald H. Wykes
- Keith C. Hong