Analysis and Characterization of GaN Based Materials and Devices.

Abstract

We calculated the elastic strain relaxation in wurtzite GaN-AlN-GaN semiconductor-insulator-semiconductor (SIS structures, Elastic strain tensor components, elastic energy, the density of the misfit dislocations, and the other parameters of the system were obtained as functions of the AlN layer thickness). Theoretical values of the elastic strain relaxation are in satisfactory agreement with experimental data extracted from capacitance voltage characteristics of GaN-AlN-GaN SIS structures. p2

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1995
Accession Number
ADA306636

Entities

People

  • John M. Money
  • Michael Shur

Organizations

  • University of Virginia

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Abstracts
  • Agreements
  • Capacitance
  • Compound Semiconductors
  • Dielectrics
  • Dislocations
  • Electrical Engineering
  • Electronics
  • Engineering
  • Experimental Data
  • Films
  • Materials
  • Military Research
  • Semiconductors
  • Silicon Carbide
  • Solid State Electronics
  • Thickness

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Semiconductor Device Technology

Technology Areas

  • Microelectronics