Adhesion of Polymers to Tungsten as Studied by Field Ion Microscopy.

Abstract

Mechanical contacts with polytetrafluoroethylene (PTFE) and polyimide polymer (PI) contacting tungsten field ion microscope emitter tips were conducted in vacuum. The metal polymer interface was examined on an atomic scale by helium field ion microscopy. Mechanical transfer was observed upon simple touch contact of the polymer materials to tungsten. The transferred polymers were stable even at the high field necessary for helium ionization, thus implying a strong chemical bonding to the metal surface. The mechanical contact stresses orient the transferred material on the tungsten surface in a radial manner from the center of contact. With sufficient load the PTFE and PI cause deformation of the tungsten. On the tungsten (110) plane, individual molecular clusters can be resolved.

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1971
Accession Number
ADA309297

Entities

People

  • Donald H. Buckley
  • William A. Brainard

Organizations

  • Glenn Research Center

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Adhesion
  • Cubic Lattices
  • Field Ion Microscopy
  • Fluoropolymers
  • Friction
  • High Voltage
  • Lubricants
  • Materials
  • Metal Contacts
  • Metals
  • Microscopes
  • Microscopy
  • Photography
  • Polymers
  • Resonant Frequency
  • Solid Lubricants
  • Vibration

Readers

  • Nanoscale Plasmonic Nanotechnology
  • Plasma Physics.
  • Thin Film Deposition Science.