Mechanical Properties of Neat Polymer Matrix Materials and Their Unidirectional Carbon Fiber-Reinforced Composites.

Abstract

The mechanical properties of two neat resin systems for use in carbon fiber/epoxy composites were characterized. This included tensile and shear stiffnesses and strengths, coefficients of thermal and moisture expansion, and fracture toughness. Tests were conducted on specimens in the dry and moisture-saturated states, at temperatures of 23 deg C, 82 deg C, and 121 deg C. The neat resins tested were American Cyanamid 1806 and Union Carbide ERX-4901B(MPDA). Results were compared to previously tested neat resins. Four unidirectional carbon fiber-reinforced composites were mechanically characterized. Axial and transverse tension and in-plane shear strengths and stiffnesses were measured, as well as transverse coefficients of thermal and moisture expansion. Tests were conducted on dry specimens only at 23 deg C and 100 deg C. The materials tested were AS4/3502, AS6/5245-C, T300/BP907, and 06000/1806 unidirectional composites. Scanning electron microscopic examination of fracture surfaces was performed to permit the correlation of observed failure modes with the environmental test conditions.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1988
Accession Number
ADA310436

Entities

People

  • Donald F. Adams
  • Richard S. Zimmerman

Organizations

  • University of Wyoming

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies
  • Space

DTIC Thesaurus Topics

  • Composite Materials
  • Computer Programs
  • Electron Microscopy
  • Fiber Reinforced Composites
  • Materials Processing
  • Materials Testing
  • Measurement
  • Mechanical Properties
  • Mechanical Working
  • Mechanics
  • Modulus Of Elasticity
  • Plastic Explosives
  • Shear Modulus
  • Shear Properties
  • Shear Stresses
  • Stress Strain Relations
  • Tensile Properties

Fields of Study

  • Materials science

Readers

  • Reinforced Composite Materials

Technology Areas

  • Microelectronics