Plastic Package Availability (PPA) Program.

Abstract

The objectives and goal are to investigate contemporary technology and provide a better understanding for the potential use of plastic encapsulated microcircuits; (PEM) in military system. In addition to the main thrust of evaluating PEM via accelerated life-testing; mold-compound material studies, sensor development, and fielded system failure analysis comprise a comprehensive program. p372

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1995
Accession Number
ADA311636

Entities

Organizations

  • National Semiconductor

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Engineered Resilient Systems
  • Ground and Sea Platforms
  • Sensors

DTIC Thesaurus Topics

  • Chemical Synthesis
  • Chemistry
  • Electronics Industry
  • Failure Mode And Effect Analysis
  • Integrated Circuits
  • Material Degradation Processes
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Mechanical Working
  • Modules (Electronics)
  • Modulus Of Elasticity
  • Semiconductors
  • Tensile Strength
  • Test And Evaluation

Readers

  • Integrated Circuit Design and Technology.
  • Software Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems