Silicon Nitride Joining Using a Sr-Celsian-Based Glass Interlayer,

Abstract

Si3N4 was successfully joined to itself using a SiO2-SrO-Al2O3 glass composition. Two compositions were evaluated as joining agents, designated SAS-5 and SAS-10 with compositions of 51:44:5 and 49:41:10 weight % SiO2:SrO:Al2O3, respectively. Microstructure of the joint region was examined by electron microprobe and X-ray diffraction. Contact angle measurements and glass characterization, including differential thermal analysis (DTA), dilatometer thermal expansion measurements and crystallization experiments, were used to evaluate each glass composition. Si3N4 plates were joined using interlayers of SAS-5 and SAS-10 glass powder ground to 75 micrometers particle size. Joining was carried out at 1450 deg C in a flowing N2 atmosphere with an applied load of only 0.01 MPa for each glass. Maximum room temperature strengths of 470 and 378 MPa were achieved in four-point bending tests for the SAS-5 and SAS-10 bonded joints, respectively.

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1996
Accession Number
ADA311711

Entities

People

  • Brian G. Quillen

Organizations

  • Air Force Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Aluminum Oxides
  • Ceramic Materials
  • Chemical Engineering
  • Chemical Reactions
  • Chemistry
  • Corrosion Resistance
  • Gas Turbines
  • Glass Transition Temperature
  • Heat Energy
  • Materials
  • Measurement
  • Phase Diagrams
  • Phase Transformations
  • Silicates
  • Tectosilicates
  • Transition Temperature
  • Turbines

Fields of Study

  • Materials science

Readers

  • Metallurgy
  • Powder metallurgy of Titanium alloys.
  • Surface Coatings Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene