Micro/Miniature Heat Pipe Technology for Electronic Cooling.

Abstract

Detailed analysis and experimental data presented in this report show that longitudinal groove designs are crucial to increase the heat transport capacity of miniature heat pipes. The steady state mathematical models of a miniature axially grooved heat pipe with micro grooves are developed where the importance of the interfacial phenomena at the surfaces of the ultra thin is emphasized. The predicted capillary and boiling limitations as well as thermal resistance are compared to detailed in-house experimental data on miniature and conventional axially grooved heat pipes. It is found that flat miniature heat pipes are easily capable of withstanding heat fluxes on the order of 100 W/sq cm at the evaporator wall. Advanced flat miniature heat pipes are suggested and modeled to further increase the maximum heat flux at the evaporator wall. Additional experiments carried out for the heat pipe evaporators with forced convection and heat fluxes in excess of 200 W/sq cm proved that capillary limitation is the limiting one for flat miniature heat pipes with micro grooves.

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1997
Accession Number
ADA341135

Entities

People

  • Amir Faghri
  • Dmitry Khrustalev

Organizations

  • Wright State University

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Computational Fluid Dynamics
  • Convection
  • Electronic Components
  • Experimental Data
  • Fluid Dynamics
  • Fluid Flow
  • Geometry
  • Heat Energy
  • Heat Flux
  • Heat Pipes
  • Heat Transfer
  • Heat Transfer Coefficients
  • Mathematical Models
  • Thermal Conductivity
  • Thermal Resistance
  • Thermodynamics
  • Two Dimensional

Fields of Study

  • Engineering

Readers

  • Combustion and Flow Dynamics.
  • Electrical Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems