Fabrication of Sub-5nm Silicon Nano-Wires and Nano Devices

Abstract

A reproducible process for fabricating silicon nanowires down to 4nm in diameter has been developed. The process, as described in previous reviews, relies on the stress limited oxidation of a thin silicon line. The initial line is fabricated by patterning an SOI wafer using electron beam lithography and a NiCr lift-off process. The post-oxidation wire was found to be very sensitive to crystallographic orientation of the line, its height/width aspect ration, and the presence of the supporting substrate.

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Document Details

Document Type
Technical Report
Publication Date
Mar 28, 2000
Accession Number
ADA381159

Entities

People

  • Jeffrey Bokor

Organizations

  • University of California, Berkeley

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Agreements
  • Aspect Ratio
  • California
  • Department Of Defense
  • Diameters
  • Electron Beam Lithography
  • Electron Beams
  • Electrons
  • Fabrication
  • Geometry
  • Lithography
  • Nanowires
  • Orientation (Direction)
  • Oxidation
  • Oxides
  • Students
  • Substrates

Fields of Study

  • Materials science

Readers

  • Integrated Circuit Design and Technology.
  • Nanoscale Plasmonic Nanotechnology
  • Thin Film Deposition Science.

Technology Areas

  • Directed Energy
  • Directed Energy - Pulsed-Laser Deposition
  • Microelectronics
  • Microelectronics - Graphene