Radiation Sensitivity of Unique Memory Devices

Abstract

Working protonated gate MOSFET transistor memories with gate lengths down to 5 microns and gate oxide thicknesses down to 20 nm have been produced using standard Si-based technological steps. Hysteresis in the source-drain current-versus-gate voltage as large as - 11 V was measured in 40 nm gate oxide transistors. The sensitivity of the memory to X rays was measured using an ARACOR source up to total accumulated doses of 2 Mrad (SiO2) . No variation in the hysteresis voltage (which would correspond to a loss of protons) was ascertained, nor was there measurable data loss (by deviation of the current/voltage characteristic which would result if the protons redistributed themselves in the gate oxide). A buildup of fixed oxide charge in the gate oxide due to irradiation was measured and it was characteristic of that expected in an unhardened oxide.

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Document Details

Document Type
Technical Report
Publication Date
Jan 24, 2002
Accession Number
ADA405716

Entities

People

  • Roderick A. Devine

Organizations

  • University of New Mexico

Tags

DTIC Thesaurus Topics

  • Air Force
  • Air Force Research Laboratories
  • Electric Fields
  • Government Procurement
  • Governments
  • Hysteresis
  • Materials
  • Memory Devices
  • Metal Oxide Semiconductors
  • Radiation
  • Radiation Effects
  • Sensitivity
  • Spacecraft
  • Standards
  • Thickness
  • Transistors
  • X Rays

Readers

  • Computational Modeling and Simulation
  • Integrated Circuit Design and Technology.
  • Semiconductor Device Technology