Modular Micromachined Si Heat Removal (MOMS Heat Removal): Electronic Integration and System Test

Abstract

The UCLA group headed by Dr. Elliott Brown and the Rockwell Scientific group headed by Dr. Michael Shaw conducted extensive research for the DARPA HERETIC Program on the integration of two heat-removal approaches with power electronic devices, (1) micro heat pipes and (2) micro spray nozzles. Two types of power devices were investigated: (1) insulated-gated bipolar transistors (IGBTs), and (2) laterally-diffused (LD) MOSFETs. Heat pipes were found to provide little or no advantage over conventional copper-based heat spreaders in both device applications. But spray nozzles made by micromachining were found to improve the heat removal of both device types through three key innovations: (1) careful design of the micronozzle to provide jets directly on the heat generating areas of the devices, (2) the use of water for the spraying to take advantage of its combination of high thermal conductivity and high latent heat of vaporization, and (3) coating the top surface of the devices prior to spraying with a conformal dielectric (Parylene C) to prevent shorting by the water. Once the spray nozzles were successfully combined with the power devices, the integrated packages were used in two system demonstrations: (1) the IGBTs in an all-solid-state motor drive, and (2) the LD-MOSFETs in a 60-W (base-station grade) RF power amplifier. Each is described below: (1) Solid-State Motor Drive. Our conventionally machined steel nozzle provided a low-pressure water spray cooling of the IGBT surfaces within a solid-state motor drive operating under speed control of a motor load. Significant challenges included the packaging of a nozzle array design in a high-power module (>650 W dissipation) that operated with high standoff voltages (V (sub rms) ^ 325 VAC).

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Document Details

Document Type
Technical Report
Publication Date
Jan 02, 2003
Accession Number
ADA412415

Entities

People

  • Elliott R. Brown

Organizations

  • University of California, Los Angeles

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Assembly
  • Fabrication
  • Heat Energy
  • Heat Of Fusion
  • Heat Transfer
  • Inverters
  • Latent Heat
  • Measurement
  • Phase Transformations
  • Power Amplifiers
  • Power Electronics
  • Radio Frequency Devices
  • Thermal Conductivity
  • Three Dimensional
  • Transition Temperature
  • Two Dimensional
  • Waveforms

Fields of Study

  • Engineering

Readers

  • Combustion and Flow Dynamics.
  • Electrical Engineering
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems