Hardening and Testing the Video Transmitter and Camera for the Shoulder-Fired Video Imager

Abstract

In support of the U.S. Army Research Laboratory's effort to develop and test a shoulder-fired video imager, the Southern California Microwave video nano-transmitter (VNTX) and Supercircuits PC182XS and PC72XS cameras were hardened (i.e, made to withstand shocks as great as 8000 g's) and shock tested. The components were tested at an acceleration that exceeds the maximum acceleration to be seen during the video imager tests on a bunker defeat munition. Shock testing revealed that filling the case of the transmitter with glass beads enabled it to sufficiently support the electronic components and allow a shock level of 8085 g's with no adverse effects. The PC182XS camera survived an equal shock level in a dedicated shock fixture but failed at a similar shock level when mounted in the imager round. The PC72XS survived shock at 7347 g's after replacement of the standard crystal oscillator with a surface-mounted crystal. Both the VNTX transmitter and PC72XS camera have been sufficiently prepared and tested to allow for use on the shoulder-fired video imager project. Further work can be done to qualify these two components for higher acceleration gun launches if desired.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Nov 01, 2004
Accession Number
ADA427965

Entities

People

  • Michael L. Nair

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies
  • Weapons Technologies

DTIC Thesaurus Topics

  • California
  • Cameras
  • Circuit Boards
  • Crystal Oscillators
  • Electronic Components
  • Hardening
  • Materials
  • Microwaves
  • Military Research
  • Munitions
  • Oscillators
  • Shock Tests
  • Shoulder
  • Spectrum Analyzers
  • Standards
  • Unmanned Aerial Vehicles
  • Video Images

Readers

  • Aerospace Test and Evaluation
  • Image Processing and Computer Vision.
  • Munitions and Ordnance Engineering

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems