Fabrication Process Changes for Performance Improvement of a RF MEMS Resonator: Conformable Contact Lithography, Moire Alignment, and Chlorine Dry Etching
Abstract
This thesis presents fabrication process improvements for a RP MEMS resonator for the purpose of improving the quality factor (Q) and extending the frequency range. The process changes include the use of conformable contact lithography (CCL) and chlorine-based dry etching for improved fine-feature patterning and moire-based alignment techniques to allow for a non-self-aligned process. The resulting control over feature size and structure are expected to improve Q and enable higher frequency resonators. A CCL process utilizing moire alignment marks is described. An automated moire-based alignment system using Labview software is presented which demonstrates sub-100 nm alignment accuracy for a single alignment mark. A full-water alignment experiment is described that demonstrates average pattern placement errors of \ 0.187 micrometers \ and \ 0.296 micrometers \ for the x and y directions respectively. The experimental limitations are analyzed and suggested improvements to the system are detailed.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 02, 2005
- Accession Number
- ADA434850
Entities
People
- Mark Sakai
Organizations
- Massachusetts Institute of Technology