Performance and RF Reliability of GaN-ON-SiC HEMTs Using Dual-Gate Architectures

Abstract

AlGaN/GaN HEMTs on SiC have been fabricated with dual and single gate device geometries. Sub-threshold characteristics and drain bias dependence of large signal parameters were compared to identify differences in electric field. Degradation under RF stress reveals the relative impact of temperature and electric field. The results illustrate the beneficial effects of the dual gate geometry for performance and reliability.

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 2006
Accession Number
ADA466887

Entities

People

  • D. S. Green
  • J. B. Shealy
  • J. D. Brown
  • J. Mckenna
  • K. Leverich
  • M. J. Poulton
  • P. M. Garber
  • R. Vetury

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Abstracts
  • Air Force
  • Air Force Facilities
  • Air Force Research Laboratories
  • Amplifiers
  • Burns
  • Degradation
  • Department Of Defense
  • Electric Fields
  • Electrical Burns
  • Geometry
  • Governments
  • Materials
  • Military Research
  • Power Amplifiers
  • Reliability
  • Thermal Resistance

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Semiconductor Device Technology