Heat Generation during Overcharge in Sealed Cells

Abstract

A popular explanation for the heat generated when a sealed cell is overcharged is that the oxygen recombination taking place at the negative electrode is an exothermic process. Although it is a fact that this recombination reaction is exothermic, the first law of thermodynamics mandates that the net enthalpy of the closed cycle oxygen recombination process is exactly zero (also known as Hess's Law). Since the closed oxygen cycle cannot produce any enthalpic heat, the heat generated must be entirely of Joule origin. The alternative mechanism discussed in this paper is that the gas evolution process displaces the electrolyte in the intercell gap and by doing that, causes a substantial increase in the internal resistance of the cell. The consequence of this resistance increase in the presence of current passing through the cell is a significant contributor to the observed heat generation. This paper presents data and discussions that support this interpretation. This mechanistic interpretation has some notable implications. That is, the heat generation process is largely chemistry independent (i.e., it is common to all sealed cell designs), is the consequence of the ability of the separator to manage the electrolyte distribution within the cell and can thermally accelerate thermodynamically spontaneous processes that have slow kinetics under normal ambient conditions.

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Document Details

Document Type
Technical Report
Publication Date
Aug 09, 2006
Accession Number
ADA469043

Entities

People

  • Henry A. Catherino

Organizations

  • Tank-automotive and Armaments Command

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Abstracts
  • Chemistry
  • Demographic Cohorts
  • Electrolytes
  • Gas Evolution
  • Heat Energy
  • Information Operations
  • Physical Chemistry
  • Recombination Reactions
  • Resistance
  • Thermodynamics

Readers

  • Battery Technology and Engineering
  • Combustion science or combustion engineering.
  • Plasma Physics.