Modularly Integrated MEMS Technology

Abstract

Process design, development and integration to fabricate reliable MEMS devices on top of VLSI-CMOS electronics without damaging the underlying circuitry have been investigated throughout this dissertation. Experimental and theoretical results that utilize two ?Post-CMOS? integration approaches will be presented. The first integration approach uses SiGe MEMS technology for the ?Post-CMOS? monolithic integration of the MEMS devices with electronics. Interconnects between SiGe MEMS and Al-TiN metallized layers have been characterized and optimized. A thorough study on Boron doping and Ge content effects on the electrical, mechanical, and chemical properties of SiGe MEMS technology has been performed. Two CMOS compatible micromachining fabrication procedures have been developed for RF and inertial sensing MEMS applications. First, a process flow that uses Ge ashing technique to define nanogaps in SiGe electrostatic MEMS transceivers for wireless communication applications has been demonstrated. Second, a multilayer SiGe MEMS process flow has been implemented for the fabrication of a freely moving disk used to pave the way towards an integrated electrostatically levitated disk sensor system for low loss inertial sensing applications. The sensor system is comprised of a disk-shaped proof-mass that is to be electrostatically suspended between sense and drive electrodes located above, below, and at the sides of the disk. The second ?Post-CMOS? integration employs the state-of-art ?back-end? materials already available in the integrated circuitry to fabricate the MEMS devices. Copper-based MEMS technology is used for the fabrication of low loss RF MEMS switches directly on top of the electronics. A model accounting for multilayer cantilever beam deflection suitable for MEMS devices fabricated with conventional ?back-end? materials was derived. Experimental results char

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Document Details

Document Type
Technical Report
Publication Date
May 23, 2006
Accession Number
ADA474116

Entities

People

  • Marie-angie N. Eyoum

Organizations

  • University of California, Berkeley

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Assembly
  • Chemistry
  • Construction
  • Electronics Industry
  • Fabrication
  • Manufacturing
  • Mass Spectrometry
  • Materials
  • Materials Processing
  • Materials Science
  • Measurement
  • Mechanics
  • Microelectromechanical Systems
  • Micromachining
  • Modulus Of Elasticity
  • Reliability
  • Semiconductors

Readers

  • Aerosol Science/Aerosol Physics
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene
  • Microelectronics - Microelectromechanical Systems