Optoelectronic Multichip Module Integration for Chip Level Optical Interconnects

Abstract

We have integrated an 850-nm vertical-cavity surface- emitting laser (VCSEL), its driver, and a diffractive lenslet array onto a single substrate to produce an integrated optoelectronic multichip module for signal fan-out and distribution. The diffractive element performs optical fan-out of the output beam from the VCSEL into an array of focused spots at a plane 1,416 um from the surface of the VCSEL. This corresponds to 160 um from the surface of the diffractive lens. System design, fabrication, integration, and experimental characterization is presented.

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Document Details

Document Type
Technical Report
Publication Date
Jun 29, 2001
Accession Number
ADA510890

Entities

People

  • Dennis W. Prather
  • Fouad Kiamilev
  • George J. Simonis
  • Joseph N. Mait
  • Marion Lecompte
  • Sriram Venkataraman

Organizations

  • University of Delaware

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Communication Systems
  • Demonstrations
  • Electron Beam Lithography
  • Electronic Mail
  • Electronics
  • Elements
  • Engineering
  • Fabrication
  • Flip Chips
  • High Density
  • Large Scale Integration
  • Lasers
  • Manufacturing
  • Modules (Electronics)
  • Multichip Modules
  • Optical Interconnects
  • Very Large Scale Integration

Fields of Study

  • Physics

Readers

  • Integrated Circuit Design and Technology.
  • Optical Physics and Photonics.

Technology Areas

  • Directed Energy
  • Microelectronics