Simulation of Prestressed Concrete Sandwich Panels Subjected to Blast Loads (Preprint)

Abstract

This paper discusses simulation methodology used to analyze static and dynamic behavior of foam insulated concrete sandwich wall panels through ultimate capacity. The experimental program used for model development and validation involved component-level testing, as well as both static and dynamic testing of full-scale wall panels. The static experiments involved single spans and double spans subjected to near-uniform distributed loading. The dynamic tests involved spans up to 30 ft tall that were subjected to impulse loads generated by an external explosion. Primary modeling challenges included: (1) accurately simulating prestressed initial conditions in an explicit dynamic code framework, (2) simulating the foam insulation in the high strain rate environment, and (3) simulating shear transfer between wythes, including frictional slippage and connector rupture. After validation, the models will be used to conduct additional behavioral studies and parametric analyses, and assess and improve methodology currently used in the design of foam insulated precast/prestressed sandwich panels for blast loads.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 2010
Accession Number
ADA519046

Entities

People

  • Bryan T. Bewick
  • Charles M. Newberry
  • James S. Davidson
  • John M. Hoemann

Organizations

  • Auburn University

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Air Force Research Laboratories
  • Blast Loads
  • Civil Engineering
  • Concrete
  • Construction
  • Construction Materials
  • Dynamic Tests
  • Engineering
  • Engineers
  • Failure Mode And Effect Analysis
  • Materials
  • Materials Laboratories
  • Materials Testing
  • Mechanics
  • Prestressed Concrete
  • Reinforced Concrete
  • Sandwich Panels

Fields of Study

  • Engineering

Readers

  • Computational Fluid Dynamics (CFD)
  • Explosive Engineering.
  • Pavement Materials Engineering.

Technology Areas

  • Microelectronics