A New Technique for Wirebonding Using Indium Spheres

Abstract

A new technique has been developed for wirebonding mercury cadmium telluride (MCT) devices using indium spheres. Indium powder with a mesh size of 170/200 is made up of indium spheres. These spheres are used as solder between the gold pad on the MCT device and the gold ball of the wirebond. This novel technique eliminates damage that typically occurs to the MCT material under gold wirebonding pads due to force and ultrasonic power needed in wirebonding.

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 2010
Accession Number
ADA527685

Entities

People

  • Kimberley A. Olver

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Abstracts
  • Bonding
  • Cold Welding
  • Department Of Defense
  • Electron Microscopes
  • Electrons
  • Governments
  • Information Operations
  • Materials
  • Microscopes
  • Microvessels
  • Military Research
  • Scanning
  • Scanning Electron Microscopes
  • Static Electricity
  • Tellurides

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