Microstructure and Texture Evolution During Hot Pack Rolling of Nickel-Base Superalloys to Thin Sheet and Foil (Preprint)

Abstract

Microstructure evolution during hot pack rolling of nickel-base superalloys to -l-mm thick sheet and -200-micron-thick foil was investigated with electron backscatter diffraction. The microstructure was observed at increasing levels of strain which revealed the progressive formation of an unrecrystallized, banded microstructure at sheet gage. The bands contained large orientation gradients, sometimes spanning multiple texture components that are considered to be stable with respect to the imposed plane-strain compression. Upon reaching stable orientations, grain-scale shear bands were observed within individual unrecrystallized bands that resulted in local subgrain rotations that formed new bands of different orientation. This phenomenon, known as band splitting in the literature, was shown to be the result of continuous dynamic recrystallization as opposed to discontinuous dynamic recrystallization or classical static recrystallization. The unrecrystallized bands were eliminated by unidirectional rolling to foil, but not by cross rolling.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 2011
Accession Number
ADA548060

Entities

People

  • Adam L. Pilchak
  • D. L. Ballard
  • D. S. Weaver
  • Sheldon Lee Semiatin

Organizations

  • Air Force Research Laboratory

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Air Force
  • Air Force Research Laboratories
  • Alloys
  • Crystal Structure
  • Crystals
  • Diffraction
  • Grain Size
  • Heat Resistant Alloys
  • Heat Treatment
  • High Temperature
  • Manufacturing
  • Materials
  • Materials Processing
  • Mechanical Properties
  • Microstructure
  • Orientation (Direction)
  • Shear Bands

Fields of Study

  • Materials science

Readers

  • Atmospheric Science / Meteorology, specifically Wind Wave Turbulence.
  • Materials Science and Engineering.
  • Mechanical Engineering/Mechanics of Materials.

Technology Areas

  • Microelectronics