Flexible and Conformal Thermal Ground Planes

Abstract

We report novel flexible thermal ground planes (FTGPs) based on heat pipe technology. FTGP's effective thermal conductivities are much higher than those of copper and graphite heat spreaders'. We report mylaraluminum, copper-Kapton, and all-polymer FTGP prototypes and advanced technologies which will further enable high-performance FTGPs.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 2012
Accession Number
ADA561953

Entities

People

  • Aziz Adbulagatov
  • Ching-yi Lin
  • Christopher Oshman
  • Li Qian
  • Li-anne Liew
  • Ming Kong
  • Ronggui Yang
  • Susan Song
  • Wei Wang
  • Xianming Dai

Organizations

  • University of Colorado Boulder

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms

DTIC Thesaurus Topics

  • Circuit Boards
  • Conductivity
  • Graphitic Materials
  • Heat Energy
  • Heat Flux
  • Heat Pipes
  • Heat Transfer
  • Heat Transfer Coefficients
  • Manufacturing
  • Materials
  • Photographs
  • Pipes
  • Printed Circuit Boards
  • Printed Circuits
  • Prototypes
  • Thermal Conductivity
  • Two Dimensional

Readers

  • Military Science and Technology Research and Modernization.
  • Solar Photovoltaics and Thermoelectric Devices.
  • Thermal Physics or Thermal Science.