Damage Study in an AA 2024 T3 Panel Subjected to Explosive Loading

Abstract

Aluminum alloys are the prime metallic materials used for light weight industrial applications. Experimental characterization of the damage in AA 2024 T3 alloy subjected to close-in blast loading is one of the critical steps to assess and improve the safety of the passenger and cargo transportation systems. Currently, several aluminum alloys are also considered by the DoD for applications such as armor for vehicles and other protection systems. AA 2024 T3 series alloys have complex microstructure, fatigue resistance, and exhibit good strength to weight ratio. They are resistant to uniform corrosion but highly susceptible to localized corrosion. An initial study of the failure mechanism of AA 2024 T3 alloy subjected to close-in explosive loading is currently underway at the U.S. Army Research Laboratory. The effect of the explosion on the microstructure and the microhardness of this alloy as a function of the distance from the center of explosion are studied by scanning electron microscopy, x-ray diffraction, energy dispersive spectroscopy, and Knoop microhardness. In addition, the position of the initiation of the alloy failure, as shown in obtained videos, is also studied in conjunction with the propagation of the damage wave through the alloy.

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Document Details

Document Type
Technical Report
Publication Date
May 01, 2012
Accession Number
ADA562288

Entities

People

  • C. Fountzoulas
  • C.‐F. Yen
  • Chun-Hui Chen
  • M. Nansteel
  • T. Sano

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Counter IED
  • Weapons Technologies

DTIC Thesaurus Topics

  • Diffraction
  • Explosions
  • Explosives
  • Hardness
  • Homeland Security
  • International Airports
  • Materials
  • Materials Science
  • Microscopes
  • Microscopy
  • Military Research
  • Radiation
  • Security
  • Spectra
  • Tensile Strength
  • X Rays
  • X-Ray Diffraction

Fields of Study

  • Materials science

Readers

  • Explosive Engineering.
  • Metallurgy
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics