Spatially-Resolved Characterization Techniques to Investigate Impact Damage in Ultra-High Performance Concretes

Abstract

Little work has been done to study the fundamental material behaviors and failure mechanisms of cement-based materials including Ordinary Portland Cement concrete (OPC) and Ultra-High Performance Concretes (UHPCs) under high-strain impact and penetration loads at lower length scales. These high-strain rate loadings have many possible effects on UHPCs at the microscale and nanoscale, including alterations in the hydration state and bonding present in phases such as Calcium Silicate Hydrate (C-S-H), in addition to fracture and debonding. In this work, the possible chemical and physical changes in UHPCs subjected to high strain-rate impact and penetration loads were investigated using a novel technique wherein nanoindentation measurements were spatially correlated with images using Scanning Electron Microscopy (SEM) and chemical composition using Energy Dispersive X-ray microanalysis (EDX). Results indicate that impact degrades both the elastic modulus and indentation hardness of UHPCs, and in particular hydrated phases, with damage likely occurring due to microfracturing and debonding.

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Document Details

Document Type
Technical Report
Publication Date
Apr 01, 2013
Accession Number
ADA581191

Entities

People

  • Mei Q. Chandler
  • Paul G Allison
  • Robert D. Moser

Organizations

  • Engineer Research and Development Center

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Chemical Analysis
  • Chemical Composition
  • Chemistry
  • Concrete
  • Coordinate Systems
  • Electron Microscopy
  • Engineering
  • Failure Mode And Effect Analysis
  • High Performance Concrete
  • Materials
  • Measurement
  • Mechanical Properties
  • Mechanics
  • Modulus Of Elasticity
  • Portland Cement
  • Scanning Electron Microscopy
  • Strain Rate

Fields of Study

  • Materials science

Readers

  • Pavement Materials Engineering.
  • Structural Health Monitoring of Composite Structures.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics