Micro-interferometry for Measurement of Thermal Displacements at Fiber/Matrix Interfaces
Abstract
A micro-interferometric technique for measuring out-of-plane thermal displacements on a scale commensurate with the dimensions of the fiber /matrix unit cell is described. A scanning micro-interferometer is used to image surface displacements of samples containing a single-pitch-based carbon fiber embedded in an epoxy matrix. The interferometer design gives the necessary resolution to detect small changes in thermal displacements in the fiber/matrix interface region. The samples were heated electrically through the fiber to create radially symmetric temperature and displacement fields. Repeatable displacement measurements were obtained on a radial line across the interface region with an accuracy of plus/minus 25A. A sharp expansion of the matrix surrounding the fiber was observed with each heating. Overall, the experiments demonstrate the utility of micro-interferometry for measuring submicron displacements.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 01, 1991
- Accession Number
- ADA601415
Entities
People
- N. R. Sottos
- R. L. Mccullough
- W. R. Scott
Organizations
- University of Illinois Urbana–Champaign