Inorganic Substrates and Encapsulation Layers for Transient Electronics

Abstract

The objective of this work was to establish a database of dissolution rates for various inorganic materials relevant to encapsulation layers and substrates for transient electronic systems, and to establish demonstration vehicles for the use of these materials in electronic devices with practical ranges of transient time. The scope of the work was to study the kinetics of dissolution in various solutions, to design and demonstrate an inorganic-based substrate system and encapsulation strategy, and to demonstrate functionality by the integration of simple transient electronic components onto these substrates with encapsulation.

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 2014
Accession Number
ADA607424

Entities

People

  • John A. Rogers

Organizations

  • University of Illinois Urbana–Champaign

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Buffers (Chemistry)
  • Chemical Vapor Deposition
  • Chemistry
  • Dielectric Properties
  • Dielectrics
  • Electrical Properties
  • Electron Microscopy
  • Electronic Components
  • Electronics
  • Inorganic Materials
  • Material Degradation Processes
  • Materials
  • Materials Processing
  • Materials Science
  • Semiconductors
  • Transient Electronics

Readers

  • Polymer Science and Engineering.
  • Surface Engineering/Surface Coating Technology.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene