Evaluation of Adhesives for Hybrid Microcircuits
Abstract
An evaluation of the use of adhesives in microcircuits was performed. Ten adhesives were subjected to physical properties analyses including TGA-RGA testing. Four of these adhesives having significant industry use were further used in the fabrication of hybrid test circuits. The circuits utilized a power transistor and a MOSFET transistor for evaluation of thermal/electrical and contamination/outgassing effects. Control samples using only eutectic bonds were also fabricated. High temperature storage, power burn-in, power cycling, thermal shock, mechanical shock, cetrifuge, and seal tests were performed. No adverse results in the areas of mechanical bond strength, surface contamination effects on the MOSFETs, or contamination effects on hybrid assembly processes were identified from the use of these adhesives for ship bonding. Electrical and thermal conductivities were decreased as compared to eutectic bonds. The evaluation indicated that the adhesives tested are viable candidates for use as chip attach in high reliability applications.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 01, 1976
- Accession Number
- ADB012981
Entities
People
- R. A. Homan
Organizations
- Martin Marietta