High-Performance Thin-Film Transistors Using Ni Silicide for Liquid-Crystal Displays
Abstract
The Ni-silicide of a sheet resistance of 7 Omega/square can be formed at 230 deg C on n(+) a-Si:H and thus can be applied to gate and source/drain contacts for high performance TFTs. Because of its low resistance it is possible to make a self-alignment between gate and source/drain which lead to a coplanar a-Si:H TFT having a low parasitic capacitance between them. The NiSi2 precipitates can be formed on a-Si:H at around 350 deg C and needlelike Si crystallites are grown as a result of the migration of the NiSi2 precipitates though a-Si:H network. Amorphous silicon can be crystallized at 500 deg C in 10 minutes in a modest electric field. The low temperature poly-Si TFT with a field effect mobility of 120 sq cm/Vs has been demonstrated using the low temperature poly-Si.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 01, 2000
- Accession Number
- ADP011297
Entities
People
- Jai I. Ryu
- Jin Jang
- Kyu S. Cho
Organizations
- Kyung Hee University