MIXED TECHNOLOGY INTEGRATION
Abstract
The goal of the Mixed Technology Integration project is to leverage advanced microelectronics manufacturing infrastructure and DARPA component technologies developed in other projects to produce mixed-technology microsystems. These 'wristwatch size', low-cost, lightweight and low power microsystems will improve the battlefield awareness, security of the warfighter and the operational performance of military platforms. At the present time, systems are fabricated by assembling a number of mixed-technology components: microelectromechanical systems (MEMS), microphotonics, microfluidics and millimeterwave/microwave. Each technology usually requires a different level of integration, occupies a separate silicon chip and requires off-chip wiring, and requires fastening and packaging to form a module. The chip assembly and packaging processes produce a high cost, high power, large volume and lower performance system. This program is focused on the monolithic integration of mixed technologies to form batch-fabricated, mixed technology microsystems 'on-a-single-chip' or an integrated and interconnected 'stack-of-chips'. The field of microelectronics incorporates micrometer/nanometer scale integration and is the most highly integrated, low-cost and high-impact technology to date. Microelectronics technology has produced the microcomputer-chip that enabled or supported the revolutions in computers, networking and communication. This program extends the microelectronics paradigm to include the integration of heterogeneous or mixed technologies. This new paradigm will create a new class of 'matchbook-size', highly integrated device and microsystem architectures. Examples of component-microsystems include low-power, small-volume, lightweight, microsensors, microrobots and microcommunication systems that will improve and expand the performance of the warfighter, military platforms, munitions and Unmanned Air Vehicles (UAVs). The program includes the integration of mixed materials on generic substrates including glass, polymers and silicon. The program is design and process intensive, using 'standard' processes and developing new semiconductor-like processes and technologies that support the integration of mixed-technologies at the micrometer/nanometer scale. The program includes the development of micrometer/nanometer scale isolation, contacts, interconnects and 'multiple-chip-scale' packaging for electronic, mechanical, fluidic, photonic and rf/mmwave/microwave technologies. For example, a mixed-technology microsystem using integrated microfluidics, MEMS, microphotonics, microelectronics and microwave components could provide a highly integrated, portable analytical instrument to monitor the battlefield environment, the physical condition of a warfighter, the identity of warfighters (friend or foe) or the combat readiness of equipment. The ability to integrate mixed technologies onto a single substrate will drive down the size, weight, volume, and cost of weapon systems while increasing their performance and reliability.
Document Details
- Document Type
- Project
- Publication Date
- Oct 01, 2013
- Source ID
- MT-15_0603739E_3_0400_PB_2013
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