MIXED TECHNOLOGY INTEGRATION
Abstract
The Mixed Technology Integration project funds advanced development and demonstrations of selected basic and applied electronics research programs. Examples of activities funded in this project include, but are not limited to: (1) component programs that integrate mixed signal (analog and digital; photonic and electronic) or mixed substrate (Gallium Nitride, Gallium Arsenide, Indium Phosphide, or Silicon Germanium with CMOS) technology that will substantially improve the capability of existing components and/or reduce size, weight and power requirements to a level compatible with future warfighter requirements; (2) development and demonstration of brassboard system applications in such areas as laser weaponry or precision navigation and timing to address mid-term battlefield enhancements; and (3) novel technological combinations (i.e., photonics, magnetics, frequency attenuators) that could yield substantial improvement over current systems.
Document Details
- Document Type
- Project
- Publication Date
- Oct 01, 2017
- Source ID
- MT-15_0603739E_3_0400_PB_2017
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