ADVANCED ELECTRONICS TECHNOLOGIES
Abstract
The Advanced Electronics Technologies program element is budgeted in the Advanced Technology Development Budget Activity because it seeks to design and demonstrate state-of-the-art manufacturing and processing technologies for the production of various electronics and microelectronic devices, sensor systems, actuators and gear drives that have military applications and potential commercial utility. Introduction of advanced product design capability and flexible, scalable manufacturing techniques will enable the commercial sector to rapidly and cost-effectively satisfy military requirements. The MicroElectroMechanical Systems (MEMS) and Integrated Microsystems Technology program is a broad, cross-disciplinary initiative to merge computation and power generation with sensing and actuation to realize a new technology for both perceiving and controlling weapons systems and battlefield environments. Using fabrication processes and materials similar to those used to make microelectronic devices, MEMS applies the advantages of miniaturization, multiple components and integrated microelectronics to the design and construction of integrated electromechanical and electro-chemical-mechanical systems. The MEMS program addresses issues ranging from the scaling of devices and physical forces to new organization and control strategies for distributed, high-density arrays of sensor and actuator elements. These issues include microscale power and actuation systems as well as microscale components that survive harsh environments. Thermal management technologies will develop heat resistant thermal layers to provide efficient operation for cooling electronic devices. The Mixed Technology Integration project funds advanced development and demonstrations of selected basic and applied electronics research programs. Examples of activities funded in this project include, but are not limited to: (1) component programs that integrate mixed signal (analog and digital; photonic and electronic) or mixed substrate (Gallium Nitride, Gallium Arsenide, Indium Phosphide, or Silicon Germanium with CMOS) technology that will substantially improve the capability of existing components and/or reduce size, weight and power requirements to a level compatible with future warfighter requirements; (2) development and demonstration of brassboard system applications in such areas as laser weaponry or precision navigation and timing to address mid-term battlefield enhancements; and (3) novel technological combinations (i.e. photonics, magnetics, frequency attenuators) that could yield substantial improvement over current systems.
Document Details
- Document Type
- R2 Budgetary Justification
- Publication Date
- Oct 01, 2017
- Source ID
- 0603739E_3_0400_PB_2017
- Change Summary Explanation
- FY 2015: Decrease reflects reprogrammings and the SBIR/STTR transfer. FY 2016: Decrease reflects congressional reduction. FY 2017: Decrease reflects completion of several Endurance, Diverse & Accessible Heterogeneous Integration (DAHI), and FLASH - Scaling Fiber Arrays at Near Perfect Beam Quality program milestones.
- Service Agency Name
- Defense Advanced Research Projects Agency
Entities
Organizations
- Defense Advanced Research Projects Agency
Related Documents
- Child Project: MEMS AND INTEGRATED MICROSYSTEMS TECHNOLOGY
- Child Accomplishment: Micro-Technology for Positioning, Navigation, and Timing (Micro PN&T)
- Child Cost Item: 9be333d8201c2ac935063531bf10bac5
- Child Cost Item: 3073e5ba2eb337c31a56d4a86c868290
- Child Cost Item: c5eb1fb6d07b4f1cb3309f1610bb832d
- Child Project: MIXED TECHNOLOGY INTEGRATION
- Child Accomplishment: Endurance
- Child Accomplishment: Diverse & Accessible Heterogeneous Integration (DAHI)
- Child Accomplishment: FLASH - Scaling Fiber Arrays at Near Perfect Beam Quality
- Child Accomplishment: Common Heterogeneous integration & IP reuse Strategies (CHIPS)*
- Child Accomplishment: Precise Robust Inertial Guidance for Munitions (PRIGM)
- Child Accomplishment: Direct SAMpling Digital ReceivER (DISARMER)
- Child Cost Item: e6ab61f7c120456bf2ccbf262be9bff1
- Child Cost Item: be617eec4c5cfb6b4a1547000b0f46bf
- Child Cost Item: e4577f1d0fb64d191d46fc34464afd82
- Child Cost Item: 328de61ea94c807de85e84314f1d178f
- Child Cost Item: 1d01f397646624b634801c9d51788ebc
- Child Cost Item: 5b52e9b61bf95a796d74a35d055c2dd9
- Child Cost Item: 22e393378808521b27fb5740c2e68aef
- Child Cost Item: 248c1712548931a5b6e20000971b4f06
- Child Cost Item: ece95ad3198544653523e3ac66514554
- Child Cost Item: 9f46cb7f2bd9c6c2b1301bafeb0bb323
- Child Cost Item: 1404ab6ae8f637de24743868c0b12f52