Diverse & Accessible Heterogeneous Integration (DAHI)
Abstract
The Diverse Accessible Heterogeneous Integration (DAHI) program is developing the design and manufacturing capabilities required to seamlessly integrate various semiconductors, microelectromechanical systems, photonic (light-manipulating) devices and thermal management structures into true systems-on-a-chip (SOC). This capability would enable dramatic size, weight and volume reductions and higher performance for DoD electronic warfare, communications and radar systems. Historically, chip designers have had to decide between the availability, development and low cost of silicon circuits or the high performance of compound semiconductor (CS) materials. DAHI, however, builds on previous DARPA and commercial efforts, which demonstrated that heterogeneously integrating CS and silicon can yield significant performance improvements over silicon or CS alone. DAHI's advanced technology development effort focuses on establishing a technologically mature manufacturing path for integrating a wide array of materials and devices, including CS, on a common substrate. Relevant manufacturing processes would be made available to a wide variety of designers from the DoD laboratories, federally funded research and development centers, academia and industry. DAHI will also support demonstrating increasingly complex circuits that leverage heterogeneous integration. DAHI technologies are intended for transition to national security and semiconductor manufacturing partners. This program has applied research efforts funded in PE 0602716E, Project ELT-01.
Document Details
- Document Type
- Accomplishment
- Publication Date
- Oct 01, 2018
- Source ID
- d735a07ffefc35c1aa09f0d2dd71ca43