ADVANCED ELECTRONICS TECHNOLOGIES

Abstract

The Advanced Electronics Technologies program element is budgeted in the Advanced Technology Development Budget Activity because it seeks to design and demonstrate state-of-the-art manufacturing and processing technologies for the production of various electronics and microelectronic devices, sensor systems, actuators and gear drives that have military applications and potential commercial utility. Introduction of advanced product design capability and flexible, scalable manufacturing techniques will enable the commercial sector to rapidly and cost-effectively satisfy military requirements. The MicroElectroMechanical Systems (MEMS) and Integrated Microsystems Technology project funded a broad, cross-disciplinary initiative to merge computation, power generation, sensing, and actuation to realize new technologies for perceiving and controlling weapons systems and battlefield environments. Using fabrication processes and materials similar to those used to make microelectronic devices, this project applied the advantages of miniaturization and integrated microelectronics to the design and construction of integrated electromechanical and electro-chemical-mechanical systems. The project addressed issues that ranged from the scaling of devices and physical forces to new organization and control strategies for distributed, high-density arrays of sensor and actuator elements. The resulting technologies will be applied to microscale precision, navigation, and timing systems; microscale components that survive harsh environments; and tactically-relevant MEMS systems that operate in a variety of thermal and vibration environments. The Mixed Technology Integration project funds the advanced development and demonstration of selected basic and applied electronics research programs. Examples of technologies with funded development and demonstration activities include, but are not limited to: (1) self-contained laser weapon systems to protect airborne platforms from emerging surface-to-air missiles; (2) integrated photonic-electronic components for positioning, navigation and timing in GPS-denied environments; (3) flexible, software-defined cameras that enable real-time image analysis of complex scenes to provide more actionable information; and (4) component programs that integrate mixed signal (analog and digital) or mixed semiconductor technology to substantially improve the capability of existing components and/or reduce their size, weight and power. Funding under this project is intended to advance transitioning novel technologies to use, providing advanced components compatible with mid-term and other future warfighting requirements.

Document Details

• Document Type: R2 Budgetary Justification
• Publication Date: Oct 01, 2018
• Source ID: 0603739E_3_0400_PB_2018
• Change Summary Explanation: FY 2016: Increase reflects reprogrammings offset by the SBIR/STTR transfer. FY 2017: N/A FY 2018: Increase reflects Rapid Array Development (RAD), Radio Frequency Collaborative Unmanned Distributed System (RF CLOUDS), and Efficient Ultra-Compact Laser-Integrated Diodes (EUCLID) new start programs.
• Service Agency Name: Defense Advanced Research Projects Agency

Entities

Organizations

• Defense Advanced Research Projects Agency

Tags

Communities of Interest

• Advanced Electronics
• Autonomy
• Energy and Power Technologies
• Sensors
• Weapons Technologies

DTIC Thesaurus Topics

• Aircrafts
• Detectors
• Fabrication
• Guidance
• Laser Beams
• Lasers
• Manufacturing
• Measurement
• Micro-Machines
• Microelectromechanical Systems
• Navigation
• Radar
• Radio Frequency
• Readout Integrated Circuits
• Semiconductors
• Unmanned Aerial Vehicles
• Weapon Systems

Readers

• Integrated Circuit Design and Technology.
• Military Science and Technology Research and Modernization.

Technology Areas

• Directed Energy
• Microelectronics
• Microelectronics - Microelectromechanical Systems
• Space