ADVANCED ELECTRONICS TECHNOLOGIES
Abstract
The Advanced Electronics Technologies program element is budgeted in the Advanced Technology Development Budget Activity because it seeks to design and demonstrate state-of-the-art manufacturing and processing technologies for the production of various electronics and microelectronic devices, sensor systems, actuators and gear drives that have military applications and potential commercial utility. Introduction of advanced product design capability and flexible, scalable manufacturing techniques will enable the commercial sector to rapidly and cost-effectively satisfy military requirements. The MicroElectroMechanical Systems (MEMS) and Integrated Microsystems Technology project is a broad, cross-disciplinary initiative to merge computation and power generation with sensing and actuation to realize a new technology for both perceiving and controlling weapons systems and battlefield environments. MEMS applies the advantages of miniaturization, multiple components and integrated microelectronics to the design and construction of integrated electromechanical and electro-chemical-mechanical systems to address issues ranging from the scaling of devices and physical forces to new organization and control strategies for distributed, high-density arrays of sensor and actuator elements. The project will also address thermal management, navigation and positioning technology challenges. The goal of the Mixed Technology Integration project is to leverage advanced microelectronics manufacturing infrastructure and DARPA component technologies developed in other projects to produce mixed-technology microsystems. These 'wristwatch size', low-cost, lightweight and low power microsystems will improve the battlefield awareness and security of the warfighter and the operational performance of military platforms. The chip assembly and packaging processes currently in use produce a high cost, high power, large volume and lower performance system. This program is focused on the monolithic integration of mixed technologies to form batch-fabricated, mixed technology microsystems 'on-a-single-chip' or an integrated and interconnected 'stack-of-chips'. The ability to integrate mixed technologies onto a single substrate will increase performance and reliability, while driving down size, weight, volume and cost.
Document Details
- Document Type
- R2 Budgetary Justification
- Publication Date
- Oct 01, 2015
- Source ID
- 0603739E_3_0400_PB_2015
- Change Summary Explanation
- FY 2013: Decrease reflects Congressional reductions for Sections 3001 & 3004, sequestration adjustments, reprogrammings, and the SBIR/STTR transfer. FY 2014: Decrease reflects a reduction for prior year carryover. FY 2015: Decrease reflects programs in thermal imaging coming to an end, micro position, navigation and timing scaling back and elimination of maskless nano-writer follow-on.
- Service Agency Name
- Defense Advanced Research Projects Agency
Entities
Organizations
- Defense Advanced Research Projects Agency
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