MEMS AND INTEGRATED MICROSYSTEMS TECHNOLOGY
Abstract
(U)The MicroElectroMechanical Systems (MEMS) and Integrated Microsystems Technology program is a broad, cross-disciplinary initiative to merge computation and power generation with sensing and actuation to realize a new technology for both perceiving and controlling weapons systems and battlefield environments. Using fabrication processes and materials similar to those used to make microelectronic devices, MEMS applies the advantages of miniaturization, multiple components and integrated microelectronics to the design and construction of integrated electromechanical and electro-chemical-mechanical systems. The MEMS program addresses issues ranging from the scaling of devices and physical forces to new organization and control strategies for distributed, high-density arrays of sensor and actuator elements. These issues include microscale power and actuation systems as well as microscale components that survive harsh environments. The microfluidic molecular systems program will develop automated microsystems that integrate biochemical fluid handling capability along with electronics, optoelectronics and chip-based reaction and detection modules to perform tailored analysis sequences to monitor environmental conditions, health hazards and physiological states. (U)The MEMS program has three principal objectives: the realization of advanced devices and systems concepts; the development and insertion of MEMS into DoD systems; and the creation of support and access technologies to catalyze a MEMS technology infrastructure. These three objectives cut across a number of focus application areas to create revolutionary military capabilities, make high-end functionality affordable to low-end systems and extend the operational performance and lifetimes of existing weapons platforms. The major technical focus areas for the MEMS program are: 1) inertial measurement; 2) fluid sensing and control; 3) electromagnetic and optical beam steering; 4) chemical reactions on chip; 5) electromechanical signal processing; 6) analytical instruments; and 7) thermal management.
Document Details
- Document Type
- Project
- Publication Date
- Oct 01, 2011
- Source ID
- MT-12_0603739E_3_0400_PB_2011
Related Documents
- Root: ADVANCED ELECTRONICS TECHNOLOGIES
- Child Accomplishment: Harsh Environment Robust Micromechanical Technology (HERMIT)
- Child Accomplishment: MEMS Exchange
- Child Accomplishment: Low Power Micro Cryogenic Coolers (MCC)
- Child Accomplishment: Microsystem Integrated Navigation Technology (MINT)
- Child Accomplishment: Integrated Primary Atomic Clock (IMPACT)
- Child Accomplishment: Nano-Electro-Mechanical Computers (NEMS)
- Child Accomplishment: Information Tethered Microscale Autonomous Rotary Stages (ITMARS)
- Child Accomplishment: Chip-Scale Micro Gas Analyzers
- Child Accomplishment: Thermal Management Technologies (TMT)