MEMS AND INTEGRATED MICROSYSTEMS TECHNOLOGY
Abstract
The MicroElectroMechanical Systems (MEMS) and Integrated Microsystems Technology program is a broad, cross-disciplinary initiative to merge computation and power generation with sensing and actuation to realize a new technology for both perceiving and controlling weapons systems and battlefield environments. Using fabrication processes and materials similar to those used to make microelectronic devices, MEMS applies the advantages of miniaturization, multiple components and integrated microelectronics to the design and construction of integrated electromechanical and electro-chemical-mechanical systems. The MEMS program addresses issues ranging from the scaling of devices and physical forces to new organization and control strategies for distributed, high-density arrays of sensor and actuator elements. These issues include microscale power and actuation systems as well as microscale components that survive harsh environments. The microfluidic molecular systems effort will develop automated microsystems that integrate biochemical fluid handling capability along with electronics, optoelectronics and chip-based reaction and detection modules for tailored sequence analysis to monitor environmental conditions, health hazards and physiological states. Thermal management technologies will develop heat resistant thermal layers to provide efficient operation for cooling electronic devices. Another focus in micro technologies is to improve navigation, position and timing capabilities for uncompromised navigation and positioning in today's dynamic military field of operations. The major technical focus areas of the MEMS and Integrated Microsystems programs contained in this project are: 1) inertial measurement; 2) fluid sensing and control; 3) electromagnetic and optical beam steering; 4) chemical reactions on chip; 5) electromechanical signal processing; 6) analytical instruments; 7) thermal management; and 8) navigation and positioning technologies.
Document Details
- Document Type
- Project
- Publication Date
- Oct 01, 2012
- Source ID
- MT-12_0603739E_3_0400_PB_2012
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