BEYOND SCALING TECHNOLOGY
Abstract
The Beyond Scaling Technology project recognizes that, within the next decade, the continuous pace of improvements in electronics performance will face the fundamental limits of silicon technology. This project pursues electronics performance advancements that exploit new concepts in circuit specialization and three-dimensional heterogeneous integration (3DHI) by the optimization of materials, devices, architectures, and designs to achieve specific circuit function at high performance. Because electronics advancements must simultaneously make progress in performance and secure the foundation on which our microelectronics infrastructure relies, this envisioned specialization will require incorporation of security safeguards and advancing manufacturing tools and process automation. Accordingly, programs within the Beyond Scaling Technology project will reduce barriers to making specialized circuits in today's silicon hardware and 3DHI by improving producibility. This will significantly increase the ease with which DoD can design, deliver, and eventually upgrade critical, customized microelectronics, particularly for operation in extreme environments. Programs also explore alternatives to traditional circuit architectures, for instance by exploiting 3DHI to optimize electronic devices and by incorporating novel materials and new techniques for securing DoD and commercial data and hardware.
Document Details
- Document Type
- Project
- Publication Date
- Oct 01, 2024
- Source ID
- ELT-02_0602716E_2_0400_PB_2024
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